- Advanced Materials Area
- Investigation and Technological Development of PCB Substrate Material for High Speed and High Frequency Applications
- Investigation of Performance of Epoxy-based Dielectric in High Performance PCB Manufacture
- Thermal characterization of embedded passive electronics devices
- Modeling the mechanical and electrical behavior of LCP-based micro-accelerators
- Polymer-matrix composite material with multiscale and multicomponent inorganic fillers
- Critical Technical Development and Industrialization of Ultra-Thin LED Back-Light Module (Collaborative Project)
- High Electrical Insulating and Thermal Conducting Polymeric Composites with Boron Nitride Nanotubes (Central Research Grant Project)
- Advanced Manufacturing Technology
- Development of plasma treatment for PCB fabrication process (Collaborative Project)
- Development of Gas-assisted Mechanical Drilling Technology in PCB Fabrication (Collaborative Project)
- A Study of Laser Cutting of Wood based Materials (Collaborative Project)
- A study on the development of manufacturing technology for metal-based copper clad laminates (Collaborative Project)
- Rigid Flex Manufacturing
- Process Characterization and Reliability in Rigid Flex Printed Circuit (RFPC) Manufacture
- Microvia Drilling and Laser Dicing
- UV-YAG Laser Drill of Glass-reinforced PCB Materials
- Surface Enable Technology for Direct Copper Drilling in Thin PCB
- Technology transfer programme for Printed Circuit Board drilling and imaging (ISF Project)
- Laser micro-machining technology for MEMS devices fabrication
- Laser Dicing Technology for Ultrathin Touch Panel / LCD Glass (Collaborative Project)
- Fine-line Circuit Patterning
- Laser-sintering of Printed Circuit board
- Laser structuring of ultra-fine line in Printed Circuit Board fabrication
- Microvia Metallisation and Electroplating
- Embedded Passives and Design Area
- Development of Embedded Passive PCB and Electronic
- Integration of embedded capacitors and resistors in multi-layer Printed Circuit Board
- Selective laser processing of Ink-jet printed nano-scaled particles for embedded passive components
- Low voltage-high impedance flying probe tester system for detecting embedded components in printed circuit boards
- Development of manufacturing technology for printed circuit board with embedded resistor components
- Quality and Reliability
- A Macroscopic and Microscopic study of different reliability of high performance PCBs (Collaborative Project)
- Plating Reliability Study of Microvia After Thermal Shocks and Cycles
- Reliability studies of lead-free advanced electronics packages and electronics assemblies
- Development of Automatic Optical Inspection (AOI) System
- Anomaly Detection and Prognostics for LED (Central Research Grant Project)
- State Estimation and Life Prediction for Lithium Battery Using Physics-of-Failure Modeling and Online Impedance Monitoring (NSFC Project)
- Environmental
- Supporting Industries to Achieve Readiness for the Imminent European Union’s Regulation (REACH) (SME Funded Project)
- An Integrated Environmental Product Assessment Model on Ecodesign for Electrical Products and Electronic Appliances
- Development of an ecodesign tool box and the conformity assessment methodologies for the CE marking requirement (2005/32/EC) of the Energy Using Products (EuPs) export to EU market (SME Funded Project)
- Development of an embedded Greenhouse Gas (GHG) emissions database with a G-BOM analyzer and a SME advisory kit for electrical and electronic industries to respond to the implementation and compliance of ISO 14067 (SME Funded Project)
- Enhancing the Environment, Health and Safety (EHS) Awareness of the WEEE Recycling Industry in HK (SME Funded Project)
